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Pui, Mak Kwok
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ui, Mak Kwok
mentioned in⁄
Applying Scientific Simulation to Integrate Thermoelectric Conductor Module into Architectural Design - Smart Wall for Thermal Comfort (2005)
Jian, Liang
Kim, Yeung
Lee, Chan Yi
Xu, Du Ru
Yeu, Tsou Jin
List of contributions:
(2005) Applying Scientific Simulation to Integrate Thermoelectric Conductor Module into Architectural Design - Smart Wall for Thermal Comfort
List of co-authors:
contributor⁄
Yeu, Tsou Jin
contributor⁄
Lee, Chan Yi
contributor⁄
Xu, Du Ru
contributor⁄
Jian, Liang
contributor⁄
Kim, Yeung
